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BGA Re-Work Mini Stencils

Mini stencils are small stencils that are used mainly for BGA rework. Mini stencils are designed to deposit precise amounts of solder paste for single BGA footprints on loaded PCBs. These precision stencils mimic the footprint and aperture sizes used in the original production stencil. StenTech mini stencils come with holders and squeegee blades, used for placing solder paste on the pads of components being reworked.

StenTech has the capability to create rework stencils for all types of components, from BGAs to BLAH, using either Gerber data or mechanical drawings.

Our mini stencil design is flexible enough to operate with a dedicated BGA rework system, as well as for use in manual printing.

StenTech's mini stencils have been designed for optimum stability and flatness and cannot contaminate surrounding areas. We use side reinforcements to prevent side-to-side shift, and front ramps to prevent solder paste spillage.

All of our mini stencils are provided with custom squeegee blades fabricated to precisely fit the particular mini stencil.

Flat plates or mounted flat plates on a mini stencil are also available. These would be used when the board has a lot of space around the components.

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BGA Re-Work Mini Stencils Image
  • IC and QFP rework
  • Heat-sink epoxy application
  • Short runs for small prototypes
  • Flux application
  • 2nd assembly thru-hole reflow
  • Small stencils that are used mainly for rework

StenTech’s Mini stencils: a big answer in a small package for BGA rework.

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“StenTech has a history of quick turnaround and dependable quality. They have always been helpful with diligent and professional service on special requests such as rush orders, custom stencil framing, reframing, and special designs for glue printing or pin through paste applications. We love doing business with StenTech.”

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