- Is best in class for positional accuracy
- Is best in class for aperture tolerance
- Is equipped with maximized paste transfer efficiency for optimum paste deposit repeatability and minimal under stencil wiping
- Has stepped area(s) for optimized paste volume deposition
- Has ultrafine pitch capability
- Has laser cut apertures that have been proven to exhibit minimal to no burring, which improves solder paste release
- Is in a fiber diode laser - the laser beam has been reduced from .0023" to .0008", which produces a smoother aperture wall and in turn improves solder paste release
- Has laser cut stencils that can be shipped the same day if approval is received by 2pm